MICRO LEADFRAME PACKAGE

'Micro Leadframe Package' (MLP) is a family of integrated circuit QFN packages, used in surface mounted electronic circuits designs. It is available in 3 versions which are MLPQ (Q stand for Quad), MLPM ( Mstands for Micro) and MLPD (dual). These package generally have exposed die attach pad to improve thermal performance. This package is near about CSP packages in construction. MLPD are designed to provide a footprint compatible replacement for SOIC packages.